发明名称 |
WAFER UND VERFAHREN ZU SEINER HERSTELLUNG |
摘要 |
A wafer having chamfered bent portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer such as an orientation flatness. The chipping of the wafer can be prevented, and in coating the wafer with a photoresist, forming an epitaxially grown layer on the wafer, etc., films having desired characteristics can be provided on the surface of the wafer. |
申请公布号 |
DE3326356(A1) |
申请公布日期 |
1984.02.09 |
申请号 |
DE19833326356 |
申请日期 |
1983.07.21 |
申请人 |
HITACHI,LTD. |
发明人 |
MAEJIMA,HISASHI;NISHIZUKA,HIROSHI;KOMORIYA,SUSUMU;EGASHIRA,ETUO |
分类号 |
H01L21/02;B24D5/02;C30B33/00;H01L21/304;H01L23/544;H01L29/06;(IPC1-7):01L21/302;28D5/00 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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