Copper plating procedure

摘要

A process is described for the electrodepositon of copper on various surfaces. The process involves use of a nonconsumable counterelectrode. Of particular significance is the composition of the surface of the counterelectrode. The surface of the counterelectrode comprises iridium oxide and tantalum oxide. Such processes can be carried out at high speeds, with smaller and more efficient equipment and can use various copper compounds as a source of copper.