| 摘要 |
A modified low-density flexible polyurethane foam product having a relatively high degree of firmness as well as commercially acceptable dielectric heat sealing characteristics. The product formulation includes an intermediate constituted by a mixture of polyol and a polymer/polyol in a ratio imparting to the product a predetermined degree of firmness, and a thermoplastic additive whose dielectric loss index is greater than the loss index of polyurethane foam to impart to the product an acceptable dielectric heating response in a high frequency electric field. This response is enhanced by a styrene component included in the polymer/polyol.
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