| 摘要 |
<p>A system for testing an electronic circuit wafer using a universally movable test head (50) for housing at least one circuit card (75) at which test signals are generated for testing the circuit wafer. A novel load/probe board (82) is mounted in the test head with a plurality of probes (80) on it. The probes are secured to the board at an inner area thereof so that they are positioned over the electronic wafer being tested. The board has electrical contacts (94) at its outer periphery and means (90, 94) are disposed over the board at its outer region to provide an electrical connection between the circuit card (75) and the board (82). Electric circuit runs connect the contacts (94) to the probes (80).</p> |
