发明名称 EPOXY RESIN COMPOSITON
摘要 PURPOSE:The titled composition curable at normal temperature, having improved adhesiveness at extremely low temperature, obtained by blending a specific epoxy resin mixed system with a specified curing agent mixed system in a specific ratio, adding a specific amount of an inorganic fibrous substance to at least one mixed system. CONSTITUTION:An epoxy resin mixed system consisting essentially of a nonalicyclic epoxy resin (e.g., glycidyl ether resin, etc.) having >=1.7 epoxy group per molecule on an average and about 70-1,000 epoxy equivalent is blended with a curing agent mixed system consisting essentially of 15-95wt% polyether polyamine such as polyoxyethyleneamine, etc. and 85-5wt% liquid acrylonitrile- butadiene copolymer having >=1.7 primary and secondary amino groups per molecule on an average in such a way that an amount of active hydrogen in amino group of the curing agent mixed system is 0.2-2.0 equivalent based on epoxy group, and at least one of the blended systems is blended with 10-65wt% inorganic fibrous material (e.g., asbestos, etc.) to give the desired epoxy resin composition.
申请公布号 JPS59147014(A) 申请公布日期 1984.08.23
申请号 JP19830021167 申请日期 1983.02.09
申请人 NITTO DENKI KOGYO KK 发明人 SHIMIZU MASAHITO;KATAYAMA SHIGERU;MURAKAMI AKIRA;HARA KOUJI
分类号 C08G59/00;C08G59/18;C08K7/04;C08L7/00;C08L9/02;C08L21/00;C08L33/00;C08L33/02;C08L63/00;C09J163/00 主分类号 C08G59/00
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