| 摘要 |
PURPOSE:To improve heat-resistant characteristics and avoid the mingling of impurities and contaminants by a method wherein the surface of a main body, formed of heat-resistant material such as silicon, is covered with a silicon nitride film. CONSTITUTION:The surface of a main body 2, formed of heat-resistant material such as silicon, is covered with a silicon nitride film 10. The heat-resistant material is a sintered substance whose main component is polycrystalline silicon or silicon carbide. The silicon nitride film 10 is formed by CVD method or plasma method. With this constitution, even if the jig is used under the high temperature condition of higher than 1,100 deg.C, owing to its heat-resistant characteristics the heat deformation does not occur and it can hold wafers 9 firmly. Also the penetration of impurities and contaminants into the main body 2 is avoided. |
