Substrate heat treatment device

摘要

A substrate heat treatment device includes: a heating plate that mounts a wafer and performs a heat treatment on the wafer; a substrate transfer arm that transfers the wafer to the heating plate and is movable from and toward the heating plate; a transfer arm moving device that moves the substrate transfer arm between a position above the heating plate and a standby position of the substrate transfer arm apart from the heating plate; a substrate transfer device that transfers the wafer to and from the substrate transfer arm located at the standby position. The substrate heat treatment device further includes a cooling arm serving as a substrate holding unit configured to cool a previously heat-treated wafer by the heating plate and transfer a next wafer to the heating plate while the previously heat-treated wafer is transferred to the substrate transfer device.

主权项

1. A substrate heat treatment device comprising:
a heating plate that mounts thereon a substrate and performs a heat treatment on the substrate; a substrate transfer arm that transfers the substrate to the heating plate and is movable from and toward the heating plate; an arm moving device that moves the substrate transfer arm between a position above the heating plate and a standby position of the substrate transfer arm apart from the heating plate; a substrate cooling arm that is disposed above the substrate transfer arm and transfers the substrate to the heating plate and is movable from and toward the heating plate; a cooling arm moving device that moves the substrate cooling arm between the position above the heating plate and a standby position of the substrate cooling arm apart from the heating plate; a substrate transfer device that transfers the substrate to and from the substrate transfer arm or the substrate cooling arm located at the standby position of the substrate transfer arm or the substrate cooling arm; a controller that controls the arm moving device and the cooling arm moving device; and a housing comprising a top wall, a bottom wall, and a plurality of sidewalls positioned between the top wall and the bottom wall, the housing configured to accommodate therein the heating plate, the substrate transfer arm, the arm moving device, the substrate cooling arm and the cooling arm moving device, wherein the controller is configured to control the arm moving device and the cooling arm moving device to allow the substrate transfer arm to transfer a first substrate previously heat-treated on the heating plate to the standby position of the substrate transfer arm, and simultaneously to allow the substrate cooling arm to transfer a second substrate to be heat-treated to the heating plate, the arm moving device includes a first rail fixed to a first side of one of the plurality of sidewalls of the housing, the cooling arm moving device includes a second rail fixed to a second side of said one of the plurality of sidewalls of the housing such that the first and second rails are disposed on opposite sides of the heating plate, the substrate transfer arm extends inwardly towards the heating plate from the first rail and the substrate cooling arm extends inwardly towards the heating plate from the second rail, and the first and second rails are parallel to each other.