| 摘要 |
PURPOSE:To obtain solid bonding by forming a groove to the bonding surface of an external lead in a flat type semiconductor device. CONSTITUTION:Grooves 8 are formed to the lower surfaces of external leads 2 for an IC. Consequently, since distances are kept among metallic wirings 4 and the leads 2 even in a reflowing method by the pressing of a heater-block, solder sufficient for bonding collects, and solid bonding is obtained. Since sections among the lower surfaces of the leads 2 and the wirings 4 are bonded strongly, the semiconductor device may not depend upon bonding by the side sections of the leads of the IC, the width of the metallic wirings for a substrate can be thinned up to the size close to lead width, and the IC can be mounted while corresponding to the increase of pins for the IC. |
