首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
THICK FILM MULTILAYER CIRCUIT BOARD
摘要
申请公布号
JPS59215796(A)
申请公布日期
1984.12.05
申请号
JP19830090931
申请日期
1983.05.24
申请人
NIPPON DENKI KK
发明人
SATOU KENJI
分类号
H05K3/46;(IPC1-7):H05K3/46
主分类号
H05K3/46
代理机构
代理人
主权项
地址
您可能感兴趣的专利
ELECTROLYTE FOR DEPOSITING SILVER-NICKEL ALLOY
METHOD OF REDUCING OXIDIZED NICKEL ORES
METHOD OF OBTAINING ALKYDCYCLOPENTADIEN RESINS
METHYL(ALKYL-, ARYL)HYDROSILANOLATES OF INDIUM AS ANTIOXYDANTS OF LUBRICATING OILS AND METHOD OF OBTAINING SAME
METHOD OF REGULATING PROCESS OF OBTAINING ACETYLENE
METHOD OF MANUFACTURING POLYMER CONCRETE ARTICLES
METHOD OF OBTAINING TITANIUM DIOXIDE
DETACHABLE CONNECTION OF THREE-DIMENSIONAL SECTIONS OF LOAD-HANDLING DEVICES
CONTAINER FOR TRANSPORTING AND STORING LONG ARTICLES
ARRANGEMENT FOR TRANSFER OF TUBULAR ARTICLES
PIPELINE FOR HIGH-HEAD PNEUMATIC TRANSPORT OF LOOSE MATERIALS
VERTOLIN-74 DETERGENT FOR INTER-OPERATION WASHING AND DEPRESERVATION OF METAL COMPONENTS
METHOD OF OBTAINING MONOCHLORCYCLOPROPANES
METHOD OF MANUFACTURING WALL CERAMIC ARTICLES
APPARATUS FOR BUNDLING TIMBER PACKAGES
LOOSE MATERIAL LOADING DEVICE
STORAGE
BUNKER FOR CONSTRUCTION MATERIALS
CONTAINER
LOOSE PRODUCE PACKAGING ARRANGEMENT