发明名称 COMPOSITION FOR PREPARING FOAM OF PHENOLIC RESIN
摘要 PURPOSE:The titled composition for providing foam useful as a heat insulating material having cell structure with high ratio of closed cell, obtained by blending a liquid phenolic resin of resol type with a specific amount of a specific adduct of phenol with an alkylene oxide as a surface active agent, a blowing agent, etc. CONSTITUTION:In a composition for preparing foam of phenolic resin containing a liquid phenolic resin of resol type, a surface active agent, an acidic curing agent (e.g., phenolsulfonic acid, etc.) and a blowing agent (e.g., trifluorotrichloroethane, etc.), a compound (e.g., adduct of dinonylphenol with 10mol ethylene oxide, etc.) shown by the formula (R1 and R2 are 4-12C alkyl; R3 is H, or methyl; n is 10-50) is used as the surface active agent and the amount used is 0.1-10pts.wt. based on 100pts.wt. phenolic resin.
申请公布号 JPS59226033(A) 申请公布日期 1984.12.19
申请号 JP19830101379 申请日期 1983.06.07
申请人 SHOWA KOBUNSHI KK;DAIICHI KOGYO SEIYAKU KK 发明人 HASHIBA TAKASHI;ICHIHARA AKINOBU;AMADA KENJI
分类号 C08J9/04;C08J9/14;(IPC1-7):C08J9/04 主分类号 C08J9/04
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