| 摘要 |
A method of packaging a semiconductor device during which leads (312, 313) are lanced from a bar pad (3/7) of the lead frame (310). The leads (312, 313) of the lead frame (310) remain within one plane and the bar pad (317) is displaced to a different plane in order to provide the necessary separation between the ends of the leads (312, 313) and the bar pad (317) to prevent accidental connections. A region of reduced mechanical strength is provided laterally across each lead to allow the leads to be bent after the smiconductor device and the portions of the leads adjacent to the semiconductor device are encapsulated with a plastic enclosure. At least some leads have an enlarged area within the encapsulated portion of the leads to secure and anchor the leads within the plastic forming the encapsulating enclosure. |
