THERMOSETTING RESIN MOLDING COMPOUND FOR SEALING USE AND ELECTRONIC PARTS MANUFACTURED USING THE SAME,申请号JP19830203180-传众专利搜索

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发明名称	THERMOSETTING RESIN MOLDING COMPOUND FOR SEALING USE AND ELECTRONIC PARTS MANUFACTURED USING THE SAME
摘要
申请公布号	JPS6094428(A)	申请公布日期	1985.05.27
申请号	JP19830203180	申请日期	1983.10.28
申请人	MATSUSHITA DENKO KK	发明人	KAGAWA HIROHIKO
分类号	H01C1/02;C08G59/00;C08G59/40;C08G59/62;C08G85/00;C08L7/00;C08L21/00;C08L63/00;C08L67/00;H01L23/29;H01L23/31	主分类号	H01C1/02
代理机构		代理人
主权项
地址

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