| 摘要 |
PURPOSE:To improve the strength, heat radiating power, heat resistance and solderability by adding prescribed percentages of Ni and P to Cu. CONSTITUTION:This Cu alloy for a material of an electronic apparatus consists of 1-4wt% Ni, 0.2-0.8wt% P and the balance Cu. The alloy is used as the material of a lead frame for IC or LSI, and it has superior strength, heat radiating power resistance, solderability and adhesive strength to plating.
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