Radiation-curable resin composition

摘要

A radiation-curable resin composition is disclosed. It comprises 0.1 to 10 parts by weight of a photosensitizer added to 100 parts by weight of a mixture of 40 to 95 wt % of a resin having a molecular weight of at least 300 and at least one ethylenically unsaturated group in the molecule and 60 to 5 wt % of epsilon -caprolactone modified 2-hydroxyethyl acrylate or methacrylate of the formula: <IMAGE> wherein R=H or CH3 and n is 1 to 10. The composition has a high boiling point, low viscosity and shows reduced skin irritation and rash capability without sacrificing its inherent radiation-curing capability.