| 摘要 |
PURPOSE:To enable to obtain excellent moisture resistance by a method wherein an interlayer insulation layer is made of a photo or radiation-sensitive polyamide composite having high sensitivity and not changing in quality at the time of development. CONSTITUTION:A conductor metal is deposited on a substrate 7 with necessary built-in elements, and the lower conductor layer 8 of required pattern is formed. Next, it is coated with the solution of a photo-sensitive polyamide composite having high sensitivity and not changing in quality at the time of development, and a polyamide composite layer 9 is formed by evaporating the solvent. Then, it is exposed to light by the use of a photo mask and developed, resulting in the formation of through holes 10. The layer 9 is inverted into a polyimide resin layer 11. The upper conductor layer 12 is deposited over the whole substrate and formed by the photoetching technique into a required pattern electrically connected at the parts of the through holes 10 of the layers 8 and 11. Thereby, the multilayer wiring structure having excellent moisture resistance can be obtained. |
