| 摘要 |
PURPOSE:To disuse a protection resistance for a burn-in board and to increase the number of sockets by packaging only conforming articles which are decided and selected by an automatic inserting machine on the burn-in board and taking a test. CONSTITUTION:A semiconductor device 10 falling in the shoot 5 of the automatic inserting device is supplied to a test part 6 to make an open and a short check; nonconforming articles are rejected at a sorting part 7 and only a conforming device 10 is packaged on a burn-in board consisting of a substrate 1, reinforcing plate 2, sockets 3, etc., to be used in a temperature cycle test. Therefore, the burn-in board need not be provided with the protection resistance and the number of sockets is increased to test the temperature cycle of the semiconductor device with high efficiency by using the burn-in board equipped with high- density sockets.
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