发明名称 DEVICE FOR AUTOMATIC COMPENSATION AND CONTROL OF PLATING CURRENT
摘要 PURPOSE:To improve the quality and corrosion resistance of plating and to improve electrode efficiency by controlling the distribution rate of plating to each plating cell according to the tracking of a strip so that plating current density can be controlled in a prescribed range. CONSTITUTION:A titled device is provided with a selection circuit 13 which selects the plating cells 3a-d to be conducted with electricity according to a line speed in prescribed order and a control circuit which compensates the excess or shortage of the coating weight of plating arising in the stage of changing the number of the cells. The above-described control circuits controls the distribution rate of the plating current to the cells 3a-d according to the tracking of a strip 1. The circuit controls the current according to the result obtd. by comparing the total sum of the plating current supplied to the cells 3a-d and the current reference compensated so as to obtain the plating current density in a prescribed range in accordance with the line speed of the strip 1.
申请公布号 JPS60128295(A) 申请公布日期 1985.07.09
申请号 JP19830237711 申请日期 1983.12.16
申请人 SHIN NIPPON SEITETSU KK;MITSUBISHI DENKI KK 发明人 NAGANO KATSUMI;SATOU MICHIO;GOSHI HIROO;KAWAMOTO HARUO;HAMADA SHIGEJI;SHIIKI YASUO
分类号 C25D7/06;C25D21/12;G01N27/42 主分类号 C25D7/06
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