发明名称 |
DEVICE FOR AUTOMATIC COMPENSATION AND CONTROL OF PLATING CURRENT |
摘要 |
PURPOSE:To improve the quality and corrosion resistance of plating and to improve electrode efficiency by controlling the distribution rate of plating to each plating cell according to the tracking of a strip so that plating current density can be controlled in a prescribed range. CONSTITUTION:A titled device is provided with a selection circuit 13 which selects the plating cells 3a-d to be conducted with electricity according to a line speed in prescribed order and a control circuit which compensates the excess or shortage of the coating weight of plating arising in the stage of changing the number of the cells. The above-described control circuits controls the distribution rate of the plating current to the cells 3a-d according to the tracking of a strip 1. The circuit controls the current according to the result obtd. by comparing the total sum of the plating current supplied to the cells 3a-d and the current reference compensated so as to obtain the plating current density in a prescribed range in accordance with the line speed of the strip 1.
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申请公布号 |
JPS60128295(A) |
申请公布日期 |
1985.07.09 |
申请号 |
JP19830237711 |
申请日期 |
1983.12.16 |
申请人 |
SHIN NIPPON SEITETSU KK;MITSUBISHI DENKI KK |
发明人 |
NAGANO KATSUMI;SATOU MICHIO;GOSHI HIROO;KAWAMOTO HARUO;HAMADA SHIGEJI;SHIIKI YASUO |
分类号 |
C25D7/06;C25D21/12;G01N27/42 |
主分类号 |
C25D7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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