发明名称 |
Method of fabricating complex micro-circuit boards and substrates and substrate |
摘要 |
A substrate and method of manufacture wherein a substrate is molded from particulate material wherein grooves on and through the body are formed during substrate molding and prior to sintering. The substrate includes all buss structure molded therein. Cooling of chips is provided by providing a heat sink in grooves formed within a substrate and beneath the chips.
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申请公布号 |
US4531145(A) |
申请公布日期 |
1985.07.23 |
申请号 |
US19820419172 |
申请日期 |
1982.09.17 |
申请人 |
FINE PARTICLE TECHNOLOGY CORPORATION |
发明人 |
WIECH, JR., RAYMOND E. |
分类号 |
H01L23/13;H01L23/36;H01L29/06;H02K44/04;H02K57/00;H05K1/09;H05K3/10;(IPC1-7):H01L23/34;H01L23/12;H01L23/48 |
主分类号 |
H01L23/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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