发明名称 METHOD AND APPARATUS FOR HEATING MOLD FOR RESIN MOLDING
摘要 PURPOSE:To make the thickness of a resin skin material formed with a mold constant while improving the working efficiency by heating a mold with the outer surface of the mold emmersed into a fluidized bed brough into contact with particles as heating medium while particles are prevented from attaching to the molding surface of the mold. CONSTITUTION:Alumina particles 7 are heated up to 200-500 deg.C with a heater 8 while air is introduced into a lower chamber S2 through an air introduction port 6 and the air introduced into the lower chamber S2 is fed into an upper chamber S1 through a filter 3. This makes the alumina particles 7 fluidized with air blown to form a fluidized bed 9. Then, a mold 10 is emmersed into the fluidized bed 9 with a specified temperature. In the process, the outer surface 10b of the mold 10 is emmersed into the fluidized bed 9 for about 20-60sec to avoid the adhesion of the particles 7 to the inner surface 10a of the mold serving as molding surface. In the subsequent process, a melted resin layer is formed on the inner surface 10a of the mold with a high temperature and cooled to obtain a resin skin material.
申请公布号 JPS60139410(A) 申请公布日期 1985.07.24
申请号 JP19830247554 申请日期 1983.12.27
申请人 HONDA GIKEN KOGYO KK 发明人 KUMAGAI TOSHIO;TSUYUKI EIJI;NAKAJIYOU KENICHI
分类号 B29C33/02;B29C41/08;B29C41/46 主分类号 B29C33/02
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