| 发明名称 |
Substrate for semiconductor modules and method of manufacture |
| 摘要 |
A method for manufacturing a semiconductor substrate. A copper sheet is placed on a surface of a ceramic plate and bonded thereto. A circuit pattern is then formed on the copper sheet by an etching process.
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| 申请公布号 |
US4540462(A) |
申请公布日期 |
1985.09.10 |
| 申请号 |
US19830558583 |
申请日期 |
1983.12.06 |
| 申请人 |
TOKYO SHIBAURA DENKI KABUSHIKI KAISHA |
发明人 |
MIZUNOYA, NOBUYUKI;KOHAMA, HAJIME;SUGIURA, YASUYUKI |
| 分类号 |
H01L23/12;C04B41/88;H01L21/48;H01L21/52;H01L23/15;H05K1/03;H05K3/38;(IPC1-7):C23F1/02;B44C1/22;C03C15/00;C03C25/06 |
主分类号 |
H01L23/12 |
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