发明名称 RESIN COVERING COMPOSITION OF HEAT CURING TYPE
摘要 PURPOSE:The titled composition useful as a cathode electrodeposition coating compound, having improved low-temperature curing properties, self-curing properties, self-curing properties, corrosion resistance, etc., comprising a specific film- forming resin containing a tertiary nitrogen atom directly bonded to a functional group, as a resin binder material. CONSTITUTION:The desired composition comprising a film-forming resin containing two or more tertiary nitrogen atoms (these tertiary nitrogen atoms may be linked to R1, R2, and a nitrogen atom bonded to them to constitute a member of a nitrogen-containing heterocyclic ring formed by them) directly linked to a functional group shown by the formula [R1 is 1-18C bifunctional saturated hydrocarbon group which may be replaced with hydroxyl group and/or linked to ether bond; R2 is H, (substituted) 1-6C alkyl, or part of main chain of the resin; R3 is H, or 1-12C hydrocarbon which may be replaced with hydroxyl group and/or linked to ether bond] in one molecule, as a resin binder material.
申请公布号 JPS60181168(A) 申请公布日期 1985.09.14
申请号 JP19840035320 申请日期 1984.02.28
申请人 KANSAI PAINT KK 发明人 TOMINAGA AKIRA
分类号 C08F8/00;C08F8/32;C09D5/44;C09D201/02 主分类号 C08F8/00
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