| 摘要 |
PURPOSE:To prevent direct contact of loaded components with a printed board by outer coating of resin over a hybrid IC by a method wherein the creeping of the resin is prevented by forming bends which block its creeping in a part of ways to the electric connection. CONSTITUTION:This is an application to the hybrid IC where bear chips 2a as active elements have been mounted to the front 1a of an insulation substrate and bonded, and active element 2a such as a mold IC, a mold transistor, and diode and a passive element 2b such as capacitor have been loaded by soldering. Outer terminals 3 of the hybrid IC are bent in U-shape at their bases, thus forming loading parts 3b to be inserted to the substrate 1; besides, bends 3c which block the creeping of resin are formed by bending a part of ways of the electric connections 3a in U-shape, with these left at terminals. |
