| 摘要 |
A curable phenolic resin composition comprising (A) a major proportion of an aqueous phenolic resole resin and (B) a minor proportion of a poly(1,2-alkylene oxide) having terminating groups selected from the group comprising -NH2, -CONH2, -CH.CO.NH2 and -OCONH2 groups. The compositions are preferably cured with an acid catalyst and post cured at an elevated temperature. |
