| 摘要 |
PURPOSE:A prepreg sheet with a low dielectric constant and suitably used for the manufacture of a printed circuit board, obtained by forming a layer of a heat-melting and hardening resin on the surface of the layer of a reinforcement impregnated with a fluororesin. CONSTITUTION:A reinforcement in sheet for formed by impregnating or coating glass fibers, aramid fibers, etc. with a fluororesin (e.g. a tetrafluoroethylene polymer) is given a treatment such as chemical etching or plasma treatment. Then, on both faces of the obtained reinforcement, a heat-melting and hardening resin (e.g. an epoxy resin or a phenolic resin) is applied, and is dried at about 90-100 deg.C for about 10min to give a prepreg sheet. A required number of plies of the prepreg sheets laid up together with copper foils on top and bottom are heated and pressed to obtain a copper-clad laminate. |
