SOLID STATE OPTOELECTRONIC DEVICE WITH PREFORMED METAL SUPPORT SUBSTRATE

摘要

A wafer-level process for manufacturing solid state lighting (“SSL”) devices using large-diameter preformed metal substrates is disclosed. A light emitting structure is formed on a growth substrate, and a preformed metal substrate is bonded to the light emitting structure opposite the growth substrate. The preformed metal substrate can be bonded to the light emitting structure via a metal-metal bond, such as a copper-copper bond, or with an inter-metallic compound bond.

主权项

1. A wafer comprising a plurality of solid state lighting (“SSL”) devices, the wafer comprising:
a preformed metal substrate at least approximately four inches in diameter; and a light emitting structure, wherein the light emitting structure is bonded to the preformed metal substrate, and the preformed metal substrate has a thickness sufficient to inhibit bowing of the light emitting structure.