| 摘要 |
PURPOSE:To reduce amount of process and to improve productivity by a method wherein a photosensitive polyimide is used as an insulation film and the heat- treatment process thereof doubles as heat-treatment for reducing electric resistance between wirings. CONSTITUTION:The first layer Al wiring 2 is formed on a substrate 1, and thereon, the second layer Al wiring 4 is formed through an interlayer insulation film 3 and this second layer Al wiring 4 is connected to the first layer Al wiring 2 through a through-hole which is provided in the interlayer insulation film 3, and an upper layer insulation film is formed so as to cover the second layer Al wiring 4. In this case, a photosensitive polyimide, which is a highly heat-resisting and photosensitive resin, is used to the upper layer insulation film. The final heat-treatment for obtaining a polyimide film 9, which is a highly heat-resisting resin, by curing the photosensitive polyimide, is conducted simultaneously with the heat-treatment which is performed to get conductivity between the first layer Al wiring 2 and the second layer Al wiring 4. |
