Method and apparatus for drying semiconductor wafers

摘要

A semiconductor wafer is held on a first rotating element in a manner having a first portion of one surface of the wafer stuck on the first rotating element. The first rotating element is rotated together with the wafer thus held thereon to remove moisture from surface portions of the wafer other than the first portion. Then, the wafer is held on a second rotating element in a manner having a second portion of the one surface of the wafer stuck on the second rotating element. The second rotating element is rotated together with the wafer thus held thereon to remove moisture from the surfaces of the wafer including at least the first portion thereof, thereby completely drying the wafer.