Compliant micro device transfer head

摘要

A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.

主权项

1. An electrostatic transfer method comprising:
positioning an array of compliant electrostatic transfer heads over an array of micro devices; contacting the array of micro devices with the array of compliant electrostatic transfer heads; sensing contact of the array of micro devices with the array of compliant electrostatic transfer heads; applying a voltage to the array of compliant electrostatic transfer heads to create a grip pressure for each compliant electrostatic transfer head; picking up the array of micro devices with the array of compliant electrostatic transfer heads; and releasing the array of micro devices onto a receiving substrate.