发明名称 Method of forming a cermet-containing bushing for an implantable medical device having a connecting layer
摘要 One aspect relates method of forming an electrical bushing for an implantable medical device, including generating at least one base body green compact for at least one base body from an insulating composition of materials. At least one cermet-containing conducting element green compact is formed for at least one conducting element. At least one conducting element green compact is introduced into the base body green compact. The insulation element green compact is connected to the at least one base body green compact in order to obtain at least one base body having at least one conducting element. A connecting layer is applied onto the at least one conducting element.
申请公布号 US9504840(B2) 申请公布日期 2016.11.29
申请号 US201514593637 申请日期 2015.01.09
申请人 Heraeus Deutschland GmbH & Co. KG 发明人 Pavlovic Goran;Glynn Jeremy
分类号 A61N1/375;B23K1/00 主分类号 A61N1/375
代理机构 Dicke, Billig & Czaja, PLLC 代理人 Dicke, Billig & Czaja, PLLC
主权项 1. A method for the manufacture of an electrical bushing for an implantable medical device, the method comprising: a. generating at least one base body green compact for at least one base body from an insulating composition of materials; b. forming at least one cermet-containing conducting element green compact for at least one conducting element; c. introducing the at least one conducting element green compact into the base body green compact; d. subjecting the at least one base body green compact and at least one conducting element green body compact to firing in order to obtain at least one base body having at least one conducting element; e. applying a connecting layer onto the at least one conducting element, the connecting layer applied in a thickness range between 0.1 μm to 5 μm to provide good foundation for further contacts.
地址 Hanau DE