| 摘要 |
A power module includes a substrate, a first sub-module and a second sub-module. The substrate includes plural first conducting parts, plural second conducting parts and a third conducting part. The first sub-module is disposed on the substrate, and includes a first semiconductor switch, a first diode, a first electrode, a second electrode and a third electrode. The first electrode and the second electrode are electrically connected with the corresponding first conducting parts. The third electrode is electrically connected with the third conducting part. The second sub-module is disposed on the substrate, and includes a second semiconductor switch, a second diode, a fourth electrode, a fifth electrode and a sixth electrode. The fourth electrode and the fifth electrode are electrically connected with the corresponding second conducting parts. The sixth electrode is electrically connected with the third conducting part. |
| 主权项 |
1. A power module, comprising:
a substrate comprising plural first conducting parts, plural second conducting parts and at least one third conducting part; at least one first sub-module disposed on the substrate, wherein the first sub-module comprises a first semiconductor switch, a first diode, a first electrode, a second electrode and a third electrode, wherein the first semiconductor switch comprises plural first conducting terminals, and the first diode comprises plural second conducting terminals, wherein the first electrode and the third electrode are electrically connected with the corresponding first conducting terminals of the first semiconductor switch and electrically connected with the corresponding second conducting terminals of the first diode, and the second electrode is electrically connected with the corresponding first conducting terminal, wherein the first electrode and the second electrode are contacted with the corresponding first conducting parts, and the third electrode is contacted with the third conducting part; and at least one second sub-module disposed on the substrate, wherein the second sub-module comprises a second semiconductor switch, a second diode, a fourth electrode, a fifth electrode and a sixth electrode, wherein the second semiconductor switch comprises plural third conducting terminals, and the second diode comprises plural fourth conducting terminals, wherein the fourth electrode and the sixth electrode are electrically connected with the corresponding third conducting terminals of the second semiconductor switch and electrically connected with the corresponding fourth conducting terminals of the second diode, and the fifth electrode is electrically connected with the corresponding third conducting terminal, wherein the fourth electrode and the fifth electrode are contacted with the corresponding second conducting parts, and the sixth electrode is contacted with the third conducting part. |
