| 摘要 |
PURPOSE:A semiconductor-sealing resin composition which scarcely forms fins and is excellent in flow, containing an epoxy resin, a novolak phenolic resin, a silicon oil of a specified composition and an inorganic filler as essential components. CONSTITUTION:The purpose sealing resin composition is formed by using an epoxy resin, a novolak phenolic resin, 0.01-5wt% silicon oil comprising a silicon/polyalkylene oxide copolymer [e.g., a compound of formula I (wherein Y is a group of formula II, R is a group of formula III and l, m and n are each at least 1] and 30-90wt% inorganic filler (e.g., silica powder or alumina) as essential components. If desired, a mold release, a colorant, etc., may be added to the composition. A molding freed from unfilled part and deformation of bonding wires can be obtained by molding with the above resin composition by, for example, low-pressure transfer molding.
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