| 摘要 |
PURPOSE:To elevate a reliability with absorbing a strain and with preventing the cracks of articles and the peeling of a connection part by connecting with heating with arranging the metal plate consisting of plural layers among the articles having different thermal expansions. CONSTITUTION:The forming solder 7 of the metallic plate of three layers structure pinching the solder 5 with a high melting point by a low melting point solder 6 is pinched between a solder plated radiator 1 and the ceramics substrate 2 with printed 4 electrode on its back face and heated at the temp. that the low melting point solder 6 is melted but high melting point solder 5 is not melted. Then due to one part of the high melting point solder 5 being melted but the majority being not melted according to a diffusion phenomenon the both 1, 2 are connected and the difference in the thermal expansions of the both 1, 2 cause by the temp. cycling is absorbed by the thickness of the solder. Even in case of the inner layer 5 of the metallic plate 7 being made of the metal having the thermal expansion coefficient which is larger than the ceramics substrate 2 but smaller than the radiating plate 1 the strain to be caused between the both 1, 2 is dispersed into the two of the substrate 2 and inner layer 5, and the inner layer 5 and radiator 1 and the similar effect as above is obtainable. |
