| 摘要 |
PURPOSE:To easily apply an electric field-solder plating to a conductive path by forming an electrode for electrolytic plating in common by forming a wide width of conductive path in end portion of the conductive path-wired base plate of a thermal head. CONSTITUTION:The ends of wiring patterns (a)-(g) in a conductive path 21A are extended to the end 21a of the base plate 21 and over full width of the path 21A near the end portion 21a. A wide width portion 21b where terminals are to be formed in each conductive path 21A is formed in contact with the end portion 21a. The conductive path to form data-in and -out paths h1-hn is provided with conductive path extending from its intermediate to the end 21c of the base plate 21, and a wide width portion 21d to form terminals is formed on the end of the conductive path. In manufacturing the base 21, an excess region 30 is provided on the outside in addition to the portion 21 to be the base. A pattern 21A and an electrode for electrolytic plating, electrically connected with the pattern 21A, are formed by etching on these regions 21 and 30. Since all the pattern 21A is connected with the common electrode 31, the electrolytic plating can be easily formed on the pattern 21A. The region 30 is cut off thereafter. |
