发明名称 SUBSTRATE PARTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a device which parts a mother substrate into unit substrates and carries them out and that suppresses substrates from stagnating on the whole processing line.SOLUTION: A device comprises: first to third conveyors 11, 12 and 13; a scribe unit 15; a parting unit 16; a pickup unit 17; and a conveyance control part 14. The respective conveyors 11, 12 and 13 convey substrates in a first direction. The scribe unit 15 forms a plurality of scribe lines, extending in a second direction crossing the first direction, on a top surface of a mother substrate. The parting unit 16 parts the mother substrate having the scribe lines formed into a plurality of unit substrates. The pickup unit 17 carries the plurality of unit substrates out, one by one. The conveyance control part 14 drives the respective conveyors 11, 12 and 13 at equal pitches when forming the plurality of scribe lines, extending in the second direction, on the mother substrate.SELECTED DRAWING: Figure 2B
申请公布号 JP2016210641(A) 申请公布日期 2016.12.15
申请号 JP20150093935 申请日期 2015.05.01
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 TOKUNAGA NAO
分类号 C03B33/03;B28D5/00 主分类号 C03B33/03
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