| 摘要 |
PURPOSE:To enable to reduce the pitch of pads by a method wherein a probe is separated into the lower layer probe and the upper layer probe, one end of the probes is electrically connected to the wiring conductor to be used for an electric test. CONSTITUTION:The lower probes 9 and 9' and the upper layer probes 8 and 8' are made of an insulating material 7 such as silicon resin and the like in double-layer structure. As the probes are formed in double-layer structure, it is necessary that the pitch of probe arrangement of the upper and the lower layers is set at approximately 150mum, and the pitch of pads can be changed to the pitch with which a bonding can be performed. As a result, the pitch of electrode terminals (pad) can be made small while the electric test technique and the size of the probes which were feretofore in use are being applied, thereby enabling to reduce the size of a semiconductor chip. |
