| 摘要 |
PROBLEM TO BE SOLVED: To provide a peeling device capable of peeling a protective tape (sheet) pasted to a semiconductor wafer (plate-like member), without using a complex configuration or a peeling tape causing heavy burden of running cost.SOLUTION: A peeling device 1 for peeling a protective tape 11 (sheet) pasted to a semiconductor wafer 10 (plate-like member), includes at least a holding table mechanism 3 for holding a semiconductor wafer 10 to which the protective tape 11 is pasted, hot melt coating means 6 for coating at least a part of the outer periphery of the protective tape 11 of the semiconductor wafer held by the holding table mechanism 3 with heated and melted resin, a peeling roller 49 bonded to the resin thus applied and peeling the protective tape from the semiconductor wafer 10, and moving means for moving at least one of the peeling roller 49 and holding table mechanism 3 relatively in a peeling direction parallel with the semiconductor wafer 10 from which the protective tape 11 is peeled.SELECTED DRAWING: Figure 1 |
