| 摘要 |
PURPOSE:To provide the titled composition having high heat-conductivity, good heat-dissipation and low heat-expansion coefficient, by compounding a specific amount of dihydro-oxa-phosphaphenanthrene-oxide with an epoxy resin, a phenolic resin and a filler. CONSTITUTION:The objective composition can be produced by compounding (A) an epoxy resin (a compound having >=2 epoxy groups in a molecule) with (B) a novolac-type phenolic resin as a hardener, (C) 0.02-5.0(wt)% 9,10-dihydro-9- oxa-10-phosphaphenanthrene-10-oxide of formula and (D) preferably 30-90% inorganic filler (e.g. silica powder, alumina powder, talc, glass fiber, etc.).
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