发明名称 CURABLE RESIN COMPOSITION
摘要 PURPOSE:To provide the titled composition composed of a hydrolyzate of a specific silicon compound and an epoxy resin hardener, having high elongation, giving a coating film having extremely low crack generation in the case of bending the substrate, having excellent hot-water resistance, light resistance, and adhesivity to deposited metal layer, and dyeable with disperse dye. CONSTITUTION:The objective composition is composed of (A) the hydrolyzed silicon compound of formula (m is 2-4; R<1> is alkyl, alkoxyalkyl or acyl; m R<1> may be the same or different; R<2> is 1-6C alkyl, alkenyl or aryl; m-4 R<2> may be the same or different), (B) an epoxy hardener, and if necessary (C) an epoxy resin compound. The epoxy hardener is an aluminum compound of formula Al.XnY3-n (X is -OR or halogen; R is lower alkyl; Y is ligand originated from a beta-diketone compound or beta-ketoester compound; n is 0, 1 or 2). The hydrolyzed silicon compound used is one that contains methyltrisilanol or its partial condensate.
申请公布号 JPS61166824(A) 申请公布日期 1986.07.28
申请号 JP19860012207 申请日期 1986.01.24
申请人 TORAY IND INC 发明人 TANIGUCHI TAKASHI;SUZUKI MASAHARU;FUKUHARA TSUNEYA
分类号 C08G59/00;C08G59/18;C08G59/70;C08K5/5419;C08L63/00;C09D163/00 主分类号 C08G59/00
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