发明名称 METHOD FOR MONITORING THERMAL STRESS
摘要 PURPOSE:To accurately monitor the thermal stress of an object to be monitored, by measuring the specific fluid condition in the object to be monitored and the outer surface temp. of said object to calculate non-steady temp. distribution near to actual temp. CONSTITUTION:The stress of an object to be monitored is calculated on the basis of temp. distribution calculated by a temp. distribution apparatus and internal pressure by a stress calculation apparatus. The stress value calculated by a temp. distribution calculation apparatus 2 is compared with a limit stress value by an objective value setting apparatus 4 to set an objective value used in controlling an object causing the generation of stress. A control apparatus 5 controls objective quantity so as to set the same to the objective value set by the setting apparatus 4. In this case, the calculation of temp. distribution is performed from the atmospheric temp. and heat conductivity of the single surface not insulated from heat of the object and the calculated value is corrected by suing the actually measured temp. of the heat-insulated surface to obtain temp. distribution near to actual one and, by this method, thermal stress can be accurately monitored.
申请公布号 JPS61184432(A) 申请公布日期 1986.08.18
申请号 JP19850024980 申请日期 1985.02.12
申请人 BABCOCK HITACHI KK 发明人 SASABUCHI AKIRA;KURAMOTO ATSUSHI
分类号 G01L1/00;G01K7/00;G01K13/00;G01N25/18 主分类号 G01L1/00
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