| 摘要 |
PURPOSE:To regularly seal pair chips in a substantially semispherical crest shape by connecting the end of a nozzle with an attachment formed with a substantially semispherical recess downward and filling resin having high viscosity. CONSTITUTION:An attachment 11 having a recess 10 is placed to coat pair chips 5. The end of a nozzle 9 is connected with the attachment 11. Then, resin having higher viscosity than the nozzle 9 is fed to the recess 10. This state is held for a while, and when the resin 7 is formed in a substantially semispherical crest shape, the nozzle 9 is pulled up, and the attachment 11 is separated from a substrate 1. Thus, the pair chips 5 are regularly sealed in the semispherical crest shape. |
