| 摘要 |
PURPOSE:To decrease markedly an internal strain resulting from a large change in temperature during or after molding in semiconductor sealing, by mixing an epoxy resin with a curing agent and specified fused silica as a filler. CONSTITUTION:Said fused silica as a filler is one having a mean particle diameter <=5mum, a maximum particle diameter <=20mum and a specific surface area <=5m<2>/g. Its amount of filling is 25-400pts.wt. per 100pts.wt. total of an epoxy resin and a curing agent therefor. Said epoxy resin is a compound having at least two epoxy groups in the molecule, and its examples include resins synthesized from epichlorohydrin and a bisphenol or a novolak and alicyclic epoxy resins. Examples of said curing agents include those based on amines acid anhydrides, imidazoles and tertiary amines.
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