| 摘要 |
PURPOSE:To facilitate positioning of a crystal oscillator chip and to improve the shock resistance of the crystal oscillator chip by inserting the crystal oscillator chip to a slit provided to a metallic spring so as to fix the chip. CONSTITUTION:One end of the metallic spring 11 holding the crystal oscillator chip 15 is bonded to a semiconductor element 10 constituting the oscillating circuit with a metallic fine wire 13 and formed incorporatedly by a transfer mold member 14. The other end of the metallic spring 11 has a slit 12 to which a part of the peripheral of the crystal oscillation chip 15 is inserted and the part having the slit 12 is bent to a plane of the metallic spring 11 at a right angle. The metallic spring 11 has an elasticity and acts like a buffer member.
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