| 摘要 |
PURPOSE:To effect accurate nondestructive and noncontact detection of center positions of through holes, an image signal obtained by scanning and using an image pick up tube from a surface of a multi-layer printed circuit board is subjected to binarization process and detection of a recess corresponding to a through hole and its central position is determined by an image processing means. CONSTITUTION:A through hole 5 of the core material coinciding with a perforated position of a through hole opened to front and rear surfaces of a printed circuit board 4 is provided with an image pickup appratus 8 on the front (rear) side of the board 4 and by allowing it to scan the surface of the board 4 for image pickup and an image processing is conducted basing upon the image signal thus obtained and from a difference of luminosities of a recess 7 and other surface, detection of the through hole 5 position and its center position is conducted. An image processing circuit 9 binarizes the image signal and by this binalized pattern, the central position of the through hole 5 is identified. By a detecting signal from the image processing circuit 9, a driving identifying unit 14, through driving circuits 12, 13, stop driving motors 10, 11 of X, Y tables driving the printed circuit board 4. In this position, a chip producing tool makes a through hole.
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