| 摘要 |
Method and apparatus connecting a semiconductor die 24 with a direct lead frame 14 by mounting the semiconductor die 24 on a mechanical die support 22 and using the support 22 to align bonding pads 26 on the die 24 with flexible, tapered inner leads 30 of the lead frame 14. The direct lead frame 14 has flexible tapered leads 30 to directly bond a semiconductor die 24 with the lead 20 that will ultimately form the external package lead 36. The leads 20 derived from the lead frame stock are made more flexible in the direction in which they are to be moved for bonding to a semiconductor die 24 by making the leads 20 narrower in thickness as well as in width. This structural change may be accomplished by one or more chemical step-etchings or by machining.
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