SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

摘要

The present invention provides a substrate processing method and a substrate processing apparatus capable of correctly detecting separation of a substrate from a mounting table. The substrate processing apparatus (11) comprises: a chamber (20) receiving a substrate (G) to perform plasma etching of the substrate (G) by plasma; a mounting table (21) installed in the inside of the chamber (20) to mount the substrate (G); an electrostatic adsorption electrode (27) embedded in the mounting table (21) to electrostatically adsorb the substrate (G) to the mounting table (21); a direct current (DC) power (28) to apply DC voltage to the electrostatic adsorption electrode (27); a plasma generation high frequency power (41) to supply high frequency power to generate plasma; and a DC voltage monitor (46) to monitor the DC voltage applied to the electrostatic adsorption electrode (27). When the DC voltage monitored by the DC voltage monitor (46) exceeds a predetermined threshold, the plasma generation high frequency power (41) stops to supply the high frequency power.