发明名称 Method for manufacturing a semiconductor device
摘要 A method of epitaxying layers on a semiconductor substrate through apertures in an insulating layer formed on a substrate. The layers are grown from the substrate and extend on the insulating layer by reacting dichlorosilane, hydrogen chloride and a carrier gas flow in a chamber under reduced pressure. The layers are used for semiconductors device formation.
申请公布号 US4637127(A) 申请公布日期 1987.01.20
申请号 US19820395110 申请日期 1982.07.06
申请人 NIPPON ELECTRIC CO., LTD. 发明人 KUROGI, YUKINORI;ENDO, NOBUHIRO;TANNO, KOHETSU
分类号 H01L21/20;H01L21/762;H01L29/06;(IPC1-7):H01L21/205;H01L21/76 主分类号 H01L21/20
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