发明名称 MOUNTING STRUCTURE OF LEADLESS CHIP CARRIER
摘要 PURPOSE:To make it possible to perform high density mounting, to provide excellent electric connection and to simplify replacement of defective parts, by coupling connecting holes in a leadless chip carrier with connecting pins, which are provided in through holes in a printed wiring board, so that they can be freely attached or detached. CONSTITUTION:Connecting holes 2 in a leadless chip carrier 1 are coupled with connecting pins 5, which are inserted in through holes in a printed wiring board 3 so that they are freely attached or detached. Mounting can be performed only by coupling the connecting hole 2 of the leadless chip carrier 1 with the connecting pins 5 in the printed wiring board 3. Electric connection is excellent. The height after mounting does not become high. The mounting area is not increased. The high density mounting can be performed. Since the connecting holes 2 are coupled with the connecting pins 5 so that they are freely attached or detached, the printed wiring board 3 is not damaged and the characteristics are not deteriorated. The defective parts can be readily replaced.
申请公布号 JPS6215847(A) 申请公布日期 1987.01.24
申请号 JP19850154766 申请日期 1985.07.12
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 HIGUCHI TORU;YAMAGUCHI TOSHIYUKI;KANO TAKESHI
分类号 H01L23/50;H05K3/34;H05K3/36 主分类号 H01L23/50
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