Shaped solder pad for surface mounting electronic devices and a surface mounting position incorporating such shaped pads

摘要

Solder pads for surface mounting of devices on a circuit board are given predetermined shapes. By shaping of a solder pad, or contact pad, a device will be held in, or moved to, a desired position on melting of the solder at the pad. Improved alignment and positioning is obtained. Broadly, a contact or solder pad comprises a rectangular portion and a segmental portion, the device end resting on the rectangular portion and the segmental portion being outside of the contact position.