发明名称 |
Multiple voltage integrated circuit packaging substrate |
摘要 |
A multilayer ceramic integrated circuit packaging substrate provides a plurality of integrated circuit operating voltages at the integrated circuit mounting surface thereof without requiring a separate input/output pin and internal power distribution plane for every integrated circuit operating voltage. The substrate includes a power via for supplying a first integrated circuit operating voltage at the integrated circuit mounting surface, and a plurality of voltage converting means on the integrated circuit mounting surface for stepping down the first operating voltage to all other requisite operating voltages. The voltage converting means may be resistors or operational amplifier voltage dividers.
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申请公布号 |
US4649417(A) |
申请公布日期 |
1987.03.10 |
申请号 |
US19830534900 |
申请日期 |
1983.09.22 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BURGESS, ALLAN C.;LUSSOW, ROBERT O.;MELVIN, GEORGE E. |
分类号 |
H01L23/538;H01L23/64;H05K1/00;H05K1/02;H05K1/03;H05K3/46;(IPC1-7):H01L39/02 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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