VERFAHREN ZUM KONTAKTIEREN AUF LEITERBAHNEN, VORRICHTUNG ZUM AUSUEBEN DES VERFAHRENS UND FLUESSIGKRISTALLZELLE MIT AUFGEBONDETEN CHIP

摘要

A method of conductively attaching a chip to a substrate e.g. a liquid crystal cell includes the step of applying a spot pattern of conductive adhesive to an intermediate carrier. The pattern corresponds to the pattern of the connecting conductors on the chip. Since the intermediate carrier has a low adhesion with the adhesive the adhesive can be transferred to the conductors of the chip by contact and the chip then secured to conducting paths on the substrate. The defined predetermined geometry and the adhesive specification ensures that no short-circuit bridges form. Prior to hardening of the adhesive, a dynamic operational test of the chip can be effected with test-apparatus contacting by way of the conductor paths and if necessary a chip displaying malfunctions can be removed and exchanged. The conductor paths can be produced in thin-film technology and thereby do not represent a restriction for the substrate spacing of liquid-crystal cells which can be produced economically groupwise in a batch process.